High integration and low-temperature bonding technology in MEMS processes
~Anodic bonding, thin film metal bonding, hermetic packaging, vacuum sealing~
★How can we achieve a balance between cost and reliability for the practical application and competitiveness of MEMS!? ★A thorough explanation of the know-how for wafer-level packaging, which will be a key technology!! 【Lecture Summary】 Wafer-level packaging has become a key technology for the practical application and competitiveness of MEMS. In this lecture, we will explain the entire scope of MEMS wafer-level packaging, from key points to know-how, using abundant real-world examples.
- Company：AndTech
- Price：10,000 yen-100,000 yen
